Title of Product/ Design / Equipment:
|
Copper Plating of Stainless Steel
|
| Value Proposition:
|
Generally It is difficult to electroplate on Stainless steel. This technology enable as to plate copper on Stainless steel
|
Summary Application:
|
Used in Particle accelerator.
|
Advantages:
|
* Good adhesion
* High thickness distribution
* High throwing power and covering power
* Ductility is good
* Current efficiency and plating rate is good
* Suitable for thicker coatings.
|
Commercialization Status:
|
Already Commercialised
|
|
Tech. Readiness Level:
|
|